Resin composition for forming insulation film, manufucturing method of resin composition for forming insulation film, dry film, printed circuit board, and manufacturing method of printed circuit board

The objective of the present invention is to provide a resin composition which has stable viscosity, a coating film formed from same exhibiting high uniformity in terms of film thickness, while also being highly thixotropic, and which is capable of forming an insulation film having excellent insulat...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI, FUMITO, HASHIMOTO, SOICHI, ARAI, TAKASHI, HIGUCHI, MICHIYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The objective of the present invention is to provide a resin composition which has stable viscosity, a coating film formed from same exhibiting high uniformity in terms of film thickness, while also being highly thixotropic, and which is capable of forming an insulation film having excellent insulation reliability. This insulation film forming resin composition contains a curable resin (A), bentonite (E), a first flux (F1), and a second flux (F2). The solubility of the flux (F1) in 1 L of water at 20°C is 1 g or greater, and the solubility of the second flux (F2) in 1 L of water at 20°C is less than 1 g. Relative to the entire amount of the resin composition, the total amount of the first flux (F1) and the second flux (F2) is between 15% by mass and 50% by mass inclusive. Relative to the total amount of the first flux (F1) and the second flux (F2), the amount of the second flux (F2) is between 15% by mass and 50% by mass inclusive.