TWI807441B
The present invention provides a laminate that can eliminate adsorption defects of a substrate caused by warping of the substrate and enables electronic devices to be manufactured at high yield. The present invention pertains to a laminate that is provided with a support base material, an adhesion l...
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| Format: | Patent |
| Sprache: | chi |
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| Zusammenfassung: | The present invention provides a laminate that can eliminate adsorption defects of a substrate caused by warping of the substrate and enables electronic devices to be manufactured at high yield. The present invention pertains to a laminate that is provided with a support base material, an adhesion layer, and a substrate in said order. The substrate is provided with a dielectric multilayer film in which dielectric layers having different refractive indexes are alternately laminated on an outer surface of the substrate. The substrate provided with the dielectric multilayer film is disposed on the adhesion layer such that the dielectric multilayer film adheres in a peelable manner to the adhesion layer. |
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