TWI806976B
Provided are: an epoxy resin composition which enables the achievement of an epoxy resin cured product that has excellent tracking resistance and excellent thermal decomposition stability, while having a good balance between the tracking resistance and heat resistance, and which is suitable especial...
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| creator | OMURA, MASAKI HIROTA, KEN |
| description | Provided are: an epoxy resin composition which enables the achievement of an epoxy resin cured product that has excellent tracking resistance and excellent thermal decomposition stability, while having a good balance between the tracking resistance and heat resistance, and which is suitable especially for power semiconductor sealing; an epoxy resin cured product; and a semiconductor. An epoxy resin composition which contains, as essential components, (A) an epoxy resin represented by general formula (1), (B) a non-aromatic epoxy resin or a non-silicone rubber, which has a 5% weight loss temperature of 260°C or more, (C) a curing agent and (D) a curing accelerator, and which is characterized in that the component (B) is contained in an amount of 1-50% by weight relative to the total amount of the components (A)-(D). In the formula, n represents a number of 0-20; and G represents a glycidyl group. |
| format | Patent |
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An epoxy resin composition which contains, as essential components, (A) an epoxy resin represented by general formula (1), (B) a non-aromatic epoxy resin or a non-silicone rubber, which has a 5% weight loss temperature of 260°C or more, (C) a curing agent and (D) a curing accelerator, and which is characterized in that the component (B) is contained in an amount of 1-50% by weight relative to the total amount of the components (A)-(D). In the formula, n represents a number of 0-20; and G represents a glycidyl group.</description><language>chi</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230701&DB=EPODOC&CC=TW&NR=I806976B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230701&DB=EPODOC&CC=TW&NR=I806976B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OMURA, MASAKI</creatorcontrib><creatorcontrib>HIROTA, KEN</creatorcontrib><title>TWI806976B</title><description>Provided are: an epoxy resin composition which enables the achievement of an epoxy resin cured product that has excellent tracking resistance and excellent thermal decomposition stability, while having a good balance between the tracking resistance and heat resistance, and which is suitable especially for power semiconductor sealing; an epoxy resin cured product; and a semiconductor. An epoxy resin composition which contains, as essential components, (A) an epoxy resin represented by general formula (1), (B) a non-aromatic epoxy resin or a non-silicone rubber, which has a 5% weight loss temperature of 260°C or more, (C) a curing agent and (D) a curing accelerator, and which is characterized in that the component (B) is contained in an amount of 1-50% by weight relative to the total amount of the components (A)-(D). In the formula, n represents a number of 0-20; and G represents a glycidyl group.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAKCfe0MDCzNDdz4mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8QgNTsZEKAEAD2IbnQ</recordid><startdate>20230701</startdate><enddate>20230701</enddate><creator>OMURA, MASAKI</creator><creator>HIROTA, KEN</creator><scope>EVB</scope></search><sort><creationdate>20230701</creationdate><title>TWI806976B</title><author>OMURA, MASAKI ; HIROTA, KEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI806976BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi</language><creationdate>2023</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>OMURA, MASAKI</creatorcontrib><creatorcontrib>HIROTA, KEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OMURA, MASAKI</au><au>HIROTA, KEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TWI806976B</title><date>2023-07-01</date><risdate>2023</risdate><abstract>Provided are: an epoxy resin composition which enables the achievement of an epoxy resin cured product that has excellent tracking resistance and excellent thermal decomposition stability, while having a good balance between the tracking resistance and heat resistance, and which is suitable especially for power semiconductor sealing; an epoxy resin cured product; and a semiconductor. An epoxy resin composition which contains, as essential components, (A) an epoxy resin represented by general formula (1), (B) a non-aromatic epoxy resin or a non-silicone rubber, which has a 5% weight loss temperature of 260°C or more, (C) a curing agent and (D) a curing accelerator, and which is characterized in that the component (B) is contained in an amount of 1-50% by weight relative to the total amount of the components (A)-(D). In the formula, n represents a number of 0-20; and G represents a glycidyl group.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | TWI806976B |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T02%3A47%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=OMURA,%20MASAKI&rft.date=2023-07-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI806976BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |