TWI806976B

Provided are: an epoxy resin composition which enables the achievement of an epoxy resin cured product that has excellent tracking resistance and excellent thermal decomposition stability, while having a good balance between the tracking resistance and heat resistance, and which is suitable especial...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OMURA, MASAKI, HIROTA, KEN
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are: an epoxy resin composition which enables the achievement of an epoxy resin cured product that has excellent tracking resistance and excellent thermal decomposition stability, while having a good balance between the tracking resistance and heat resistance, and which is suitable especially for power semiconductor sealing; an epoxy resin cured product; and a semiconductor. An epoxy resin composition which contains, as essential components, (A) an epoxy resin represented by general formula (1), (B) a non-aromatic epoxy resin or a non-silicone rubber, which has a 5% weight loss temperature of 260°C or more, (C) a curing agent and (D) a curing accelerator, and which is characterized in that the component (B) is contained in an amount of 1-50% by weight relative to the total amount of the components (A)-(D). In the formula, n represents a number of 0-20; and G represents a glycidyl group.