PACKAGE AND METHOD OF MANUFACTURING THE SAME

The invention provides a package and a method for manufacturing the same, wherein electrical connection between an upper surface and a lower surface can be ensured, and solder can be prevented from unnecessarily flowing out of a large amount to a side surface. The metallization portion (200) include...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NAGAHIRO, MASANORI, NISHIJIMA, HIDETAKA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!