PACKAGE AND METHOD OF MANUFACTURING THE SAME

The invention provides a package and a method for manufacturing the same, wherein electrical connection between an upper surface and a lower surface can be ensured, and solder can be prevented from unnecessarily flowing out of a large amount to a side surface. The metallization portion (200) includes a sealing metallization layer (210) on the sealing surface (SS), a lower surface metallization layer (220) on the lower surface (P2) of the ceramic portion (100), and a side surface metallization layer (230) on the side surface (P3) of the ceramic portion (100). The side metallization layer (230) has an upper portion (231) connected to the sealing metallization layer (210), a lower portion (232) connected to the lower surface metallization layer (220), and an intermediate portion (233) connecting the upper portion (231) and the lower portion (232) to each other. The metal layer (300) is made of a metal material having higher wettability with respect to the brazing material (930) than the metallization material. T