TWI805976B

Provided is a film forming method that can form a film having a thickness of 500 µm or more with a single coating of a substrate.The present disclosure is a film forming method using a powder coating material containing a polyphenylene sulfide resin, the method including heating the powder coating m...

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Bibliographische Detailangaben
Hauptverfasser:	MIYATANI, TOSHIO, CHIN, SHICHOU, IMADA, HIROTAKE, NAKATANI, YASUKAZU, HONDA, YUKARI
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	Provided is a film forming method that can form a film having a thickness of 500 µm or more with a single coating of a substrate.The present disclosure is a film forming method using a powder coating material containing a polyphenylene sulfide resin, the method including heating the powder coating material at a temperature equal to or higher than a melting point of the polyphenylene sulfide resin and within a range of 250 to 400°C, in which a single coating of a substrate forms a film having a thickness of 500 µm or more; and the obtained film has a surface roughness, Ra, of 0.30 µm or less.