Evaluation method for cutting ingot

Evaluation method for cutting ingot

An evaluation method for cutting an ingot is provided. The evaluation method includes the following steps. Multiple sampling points on a tested slice of the ingot are set. Moreover, multiple observation surfaces are set. Each observation surface is formed by at least two adjacent sampling points. Af...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TSAI, CHIAI, HSU, WENING, LI, IING, WANG, SHANGI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator TSAI, CHIAI
HSU, WENING
LI, IING
WANG, SHANGI
description An evaluation method for cutting an ingot is provided. The evaluation method includes the following steps. Multiple sampling points on a tested slice of the ingot are set. Moreover, multiple observation surfaces are set. Each observation surface is formed by at least two adjacent sampling points. Afterwards, an average value of measured values of the sampling points included in each observation surface is calculated. In addition, the observation surface corresponding to the smallest average value is used as a cutting reference surface.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI804906BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI804906BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI804906BB3</originalsourceid><addsrcrecordid>eNrjZFB2LUvMKU0syczPU8hNLcnIT1FIyy9SSC4tKcnMS1cA4vwSHgbWtMSc4lReKM3NoODmGuLsoZtakB-fWlyQmJyal1oSHxLuaWFgYmlg5uRkTIQSALOTJqk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Evaluation method for cutting ingot</title><source>esp@cenet</source><creator>TSAI, CHIAI ; HSU, WENING ; LI, IING ; WANG, SHANGI</creator><creatorcontrib>TSAI, CHIAI ; HSU, WENING ; LI, IING ; WANG, SHANGI</creatorcontrib><description>An evaluation method for cutting an ingot is provided. The evaluation method includes the following steps. Multiple sampling points on a tested slice of the ingot are set. Moreover, multiple observation surfaces are set. Each observation surface is formed by at least two adjacent sampling points. Afterwards, an average value of measured values of the sampling points included in each observation surface is calculated. In addition, the observation surface corresponding to the smallest average value is used as a cutting reference surface.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230611&amp;DB=EPODOC&amp;CC=TW&amp;NR=I804906B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230611&amp;DB=EPODOC&amp;CC=TW&amp;NR=I804906B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSAI, CHIAI</creatorcontrib><creatorcontrib>HSU, WENING</creatorcontrib><creatorcontrib>LI, IING</creatorcontrib><creatorcontrib>WANG, SHANGI</creatorcontrib><title>Evaluation method for cutting ingot</title><description>An evaluation method for cutting an ingot is provided. The evaluation method includes the following steps. Multiple sampling points on a tested slice of the ingot are set. Moreover, multiple observation surfaces are set. Each observation surface is formed by at least two adjacent sampling points. Afterwards, an average value of measured values of the sampling points included in each observation surface is calculated. In addition, the observation surface corresponding to the smallest average value is used as a cutting reference surface.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB2LUvMKU0syczPU8hNLcnIT1FIyy9SSC4tKcnMS1cA4vwSHgbWtMSc4lReKM3NoODmGuLsoZtakB-fWlyQmJyal1oSHxLuaWFgYmlg5uRkTIQSALOTJqk</recordid><startdate>20230611</startdate><enddate>20230611</enddate><creator>TSAI, CHIAI</creator><creator>HSU, WENING</creator><creator>LI, IING</creator><creator>WANG, SHANGI</creator><scope>EVB</scope></search><sort><creationdate>20230611</creationdate><title>Evaluation method for cutting ingot</title><author>TSAI, CHIAI ; HSU, WENING ; LI, IING ; WANG, SHANGI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI804906BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>TSAI, CHIAI</creatorcontrib><creatorcontrib>HSU, WENING</creatorcontrib><creatorcontrib>LI, IING</creatorcontrib><creatorcontrib>WANG, SHANGI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSAI, CHIAI</au><au>HSU, WENING</au><au>LI, IING</au><au>WANG, SHANGI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Evaluation method for cutting ingot</title><date>2023-06-11</date><risdate>2023</risdate><abstract>An evaluation method for cutting an ingot is provided. The evaluation method includes the following steps. Multiple sampling points on a tested slice of the ingot are set. Moreover, multiple observation surfaces are set. Each observation surface is formed by at least two adjacent sampling points. Afterwards, an average value of measured values of the sampling points included in each observation surface is calculated. In addition, the observation surface corresponding to the smallest average value is used as a cutting reference surface.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TWI804906BB
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
title Evaluation method for cutting ingot
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T08%3A27%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TSAI,%20CHIAI&rft.date=2023-06-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI804906BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true