Evaluation method for cutting ingot

An evaluation method for cutting an ingot is provided. The evaluation method includes the following steps. Multiple sampling points on a tested slice of the ingot are set. Moreover, multiple observation surfaces are set. Each observation surface is formed by at least two adjacent sampling points. Af...

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Bibliographische Detailangaben
Hauptverfasser:	TSAI, CHIAI, HSU, WENING, LI, IING, WANG, SHANGI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	An evaluation method for cutting an ingot is provided. The evaluation method includes the following steps. Multiple sampling points on a tested slice of the ingot are set. Moreover, multiple observation surfaces are set. Each observation surface is formed by at least two adjacent sampling points. Afterwards, an average value of measured values of the sampling points included in each observation surface is calculated. In addition, the observation surface corresponding to the smallest average value is used as a cutting reference surface.