TWI804597B

A resin material is provided which can 1) reduce the dielectric loss tangent of a cured product, 2) increase adhesion between an insulation layer and a metal layer, 3) increase the plated peel strength, 4) increase flame retardancy of the cured product and 5) keep the curing temperature low. This re...

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Bibliographische Detailangaben
Hauptverfasser:	BABA, SUSUMU, HAYASHI, TATSUSHI, KAWAHARA, YUKO
Format:	Patent
Sprache:	chi
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	A resin material is provided which can 1) reduce the dielectric loss tangent of a cured product, 2) increase adhesion between an insulation layer and a metal layer, 3) increase the plated peel strength, 4) increase flame retardancy of the cured product and 5) keep the curing temperature low. This resin material contains an N-alkyl bismaleimide compound having a skeleton derived from dimer diamines or an N-alkyl benzoxazine compound having a skeleton derived from dimer diamines, an epoxy compound, an inorganic filler material, and a curing agent containing a specific component, wherein the weight ratio of the content of the N-alkyl bismaleimide compound having a skeleton derived from dimer diamines or the N-alkyl benzoxazine compound having a skeleton derived from dimer diamines to the total content of the epoxy compound and the curing agent is 0.05-0.75.