TWI804166B

A lamella mounting method that can achieve improvement in transport throughput is provided. Provided is a lamella mounting method including (a) a step of gripping a lamella 10 fabricated on a part of a wafer 1 and taking out the lamella 10 from the wafer 1 by nano-tweezers 62, and (b) a step of brin...

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Bibliographische Detailangaben

Hauptverfasser:	CHIBA, HIROYUKI, TAN, WEI CHEAN, KAWANISHI, SHINSUKE, NOMAGUCHI, TSUNENORI
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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