TWI804166B

A lamella mounting method that can achieve improvement in transport throughput is provided. Provided is a lamella mounting method including (a) a step of gripping a lamella 10 fabricated on a part of a wafer 1 and taking out the lamella 10 from the wafer 1 by nano-tweezers 62, and (b) a step of brin...

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Bibliographische Detailangaben
Hauptverfasser:	CHIBA, HIROYUKI, TAN, WEI CHEAN, KAWANISHI, SHINSUKE, NOMAGUCHI, TSUNENORI
Format:	Patent
Sprache:	chi
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A lamella mounting method that can achieve improvement in transport throughput is provided. Provided is a lamella mounting method including (a) a step of gripping a lamella 10 fabricated on a part of a wafer 1 and taking out the lamella 10 from the wafer 1 by nano-tweezers 62, and (b) a step of bringing the lamella 10 into close contact with a film 22 contained in a mesh 20 by moving the nano-tweezers 62 to press the lamella 10 against the film 22 while the lamella 10 is being gripped by the nano-tweezers 62, in which, after the step (b), the lamella 10 is in close contact with the film 22 so that an analysis region 11 faces the film 22.