TWI802962B

We proposed a method to reduce the probability of cracking of the semiconductor wafer during the wafer manufacturing procedure or the device forming procedure. [Solution]A method to reduce the probability of cracking of a semiconductor wafer, comprising: a third procedure which is in the process of manufacturing the semiconductor wafer from a semiconductor ingot and forming a semiconductor device on the manufactured semiconductor wafer, and is between a first procedure and a second procedure; the first procedure may cause scratches on the semiconductor wafer; the second procedure applies stress to the semiconductor wafer that has undergone the first procedure, so that the semiconductor wafer may crack; the third procedure performs bending test, so as to apply stress corresponding to stress applied to the semiconductor wafer during the second procedure to the semiconductor wafer, determines whether the semiconductor wafer will crack or not, and transports the un-cracked semiconductor wafer to the second proced