Multibath plating of a single metal

A method of electroplating a metal into features of a partially fabricated electronic device on a substrate is provided. The method includes (a) electroplating the metal into the features, to partially fill the features by a bottom up fill mechanism, while contacting the features with a first electroplating bath having a first composition and comprising ions of the metal; (b) thereafter, electroplating more of the metal into the features, to further fill the features, while contacting the features with a second electroplating bath having a second composition, which is different than the first composition, and comprises the ions of the metal; and (c) removing the substrate from an electroplating tool where operation (b) was performed.