Spout pouch and method of making same
The present disclosure includes a process for making a package having a spout. The process includes heating a sealing area of a spout to a temperature at or above a melting point of the spout material; heating two multilayer structures around a portion of their peripheries to adhere the peripheries...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure includes a process for making a package having a spout. The process includes heating a sealing area of a spout to a temperature at or above a melting point of the spout material; heating two multilayer structures around a portion of their peripheries to adhere the peripheries of sealant layers and form a partially sealed package having an opening; inserting the heated spout into the opening; and pressing opposing surfaces of the two multilayer structures around the spout to close the opening around the spout. Each multilayer structure includes a multilayer film having the sealant layer having at least 40% by weight of an ethylene-based polymer having a melting point below 112°C; an external layer including an ethylene-based polymer; and at least one intermediate layer disposed between the sealant layer and the external layer having a melting point at least 15°C higher than the sealant layer. |
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