Method to predict yield of a device manufacturing process

Method to predict yield of a device manufacturing process

A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical ch...

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Bibliographische Detailangaben
Hauptverfasser: VAN GORP, SIMON HENDRIK CELINE, HASTINGS, SIMON PHILIP SPENCER, MENCHTCHIKOV, BORIS, LERCEL, MICHAEL JAMES, YPMA, ALEXANDER, LIU, SHIHIN, DE RUITER, CHRISTIAAN THEODOOR, CEKLI, HAKKI ERGUN, DUAN, WEI, TABERY, CYRUS EMIL, TEN BERGE, PETER, ALVAREZ SANCHEZ, RUBEN, GUITTET, PIERRE-YVES JEROME YVAN, LIN, CHENXI, SONNTAG, DAG
Format: Patent
Sprache:chi ; eng
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Beschreibung
Zusammenfassung:A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.