TWI800565B

A laser processing method is disclosed which is capable of easily reducing contamination on a plastic film surface, and also capable of cutting a plastic film in a free-form shape. A laser processing method includes a process of pulsing a laser beam L having a wavelength in the infrared region from...

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Bibliographische Detailangaben
1. Verfasser:	MATSUO, NAOYUKI
Format:	Patent
Sprache:	chi
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A laser processing method is disclosed which is capable of easily reducing contamination on a plastic film surface, and also capable of cutting a plastic film in a free-form shape. A laser processing method includes a process of pulsing a laser beam L having a wavelength in the infrared region from a laser beam source 1 and causing a plastic film F to be irradiated with the laser beam L to cut the plastic film. The peak energy density of the laser beam with which the plastic film is irradiated is 70 J/cm2 or more and 270 J/cm2 or less.