Protection material for electronic circuit, method of sealing and method of producing semiconductor device

Provided is a protective material for an electronic circuit that satisfies at least the conditions in (1) or (2): (1) a protective material for an electronic circuit that comprises a resin constituent and an inorganic filler, with the filler content ratio being at least 50% by mass of the whole; (2)...

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Bibliographische Detailangaben
Hauptverfasser:	KANG, DONGCHUL, YAMAURA, MASASHI, HORI, KOHJI, ISHIBASHI, KENTA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is a protective material for an electronic circuit that satisfies at least the conditions in (1) or (2): (1) a protective material for an electronic circuit that comprises a resin constituent and an inorganic filler, with the filler content ratio being at least 50% by mass of the whole; (2) a protective material for an electronic circuit that comprises a resin component and an inorganic filler, the protective material being configured such that, if the viscosity (Pa·s) measured at 75°C and a shear velocity of 5 s− 1 is viscosity A and the viscosity (Pa·s) measured at 75°C and a shear velocity of 50 s− 1 is viscosity B, the thixotropic index at 75°C, obtained as the value of viscosity A/viscosity B, is in the range 0.1-2.5.