TWI799480B

The present invention is to separately perform temperature control on the shower plate and the base member. The substrate processing apparatus (10) comprises a nozzle head (40) that is opposite to the carrier table (30) on which the substrate (S) is placed, and disposed in the processing container (...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA, SEIJI, SATOYOSHI, TSUTOMU
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention is to separately perform temperature control on the shower plate and the base member. The substrate processing apparatus (10) comprises a nozzle head (40) that is opposite to the carrier table (30) on which the substrate (S) is placed, and disposed in the processing container (20) to eject the processing gas. The nozzle head (40) has a shower plate (41) disposed opposite to the carrier table (30), formed with a plurality of air holes (43) for discharging the processing gas into the processing container (20) and provided with a heater (50); and a base member (42) that is joined to the back side of the shower plate (41)'s opposite side opposite to the carrier table (30), and formed with a space to supply the processing gas to the plurality of air holes (43), and is provided with a flow path (60).