Composite sheet for forming protective film and method for manufacturing semiconductor chip

Provided is a composite sheet for forming a protective film, the composite sheet comprising: a support sheet and an energy-ray-curable protective film-forming film provided on the support sheet, wherein the protective film-forming film includes an energy-ray-curable component (a0) and a non-energy-r...

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Bibliographische Detailangaben
Hauptverfasser:	INAO, YOUICHI, KOBASHI, RIKIYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a composite sheet for forming a protective film, the composite sheet comprising: a support sheet and an energy-ray-curable protective film-forming film provided on the support sheet, wherein the protective film-forming film includes an energy-ray-curable component (a0) and a non-energy-ray-curable component (b), a layer in the support sheet, the layer being in contact with the protective film-forming film includes a resin component (X), an HSP polarity term δP of the resin component (X) is not more than 7.5 MPa1/2 and when an HSP space is defined and a Hansen dissolving sphere of the non-energy-ray-curable component (b) is produced in this HSP space, the HSP of the energy-ray-curable component (a0) is included in the region of the Hansen dissolving sphere of the non-energy-ray-curable component (b).