TWI796756B

An electrode hanger structure for fan-out panel level packaging electroplating mainly includes a bottom plate and a conductive frame. The bottom plate is provided with a recessed carrying area in the center of a plate body for accommodating and positioning a to-be-plated workpiece. The carrying area...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YAN, ZHEN-YI
Format:	Patent
Sprache:	chi
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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