TWI796756B

An electrode hanger structure for fan-out panel level packaging electroplating mainly includes a bottom plate and a conductive frame. The bottom plate is provided with a recessed carrying area in the center of a plate body for accommodating and positioning a to-be-plated workpiece. The carrying area is provided with a sealing strip around an inner edge, and a plurality of positioning columns protruding upwards on the outer periphery. The conductive frame is provided with a hollow part, which is slightly smaller than the carrying area of bottom plate, in the center of the frame body. An extension plate fastened with a pair of hooks is configured to protrude from the top of the frame body. A plurality of guide holes corresponding to the positioning columns of the bottom plate are provided around the frame body for allowing the conductive frame to be slidably assembled and bonded to the plate surface of the carrying area of the bottom plate. The frame body is provided with two sealant strips on the outer periphe