Microelectromechanical system microphone structure and manufacturing method thereof

A microelectromechanical system microphone structure and a manufacturing method thereof are provided. Substrate, first side plate, second side plate and cover plate are made through process combination of bonding, opening, pressing film, copper etching, solder mask and molding. ASIC is placed on cov...

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Bibliographische Detailangaben
Hauptverfasser:	YU, YUNG HSIANG, YANG, SSU CHIEH, CHEN, SHENG KAI, YANG, SHANG HSIEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS PUBLIC ADDRESS SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	A microelectromechanical system microphone structure and a manufacturing method thereof are provided. Substrate, first side plate, second side plate and cover plate are made through process combination of bonding, opening, pressing film, copper etching, solder mask and molding. ASIC is placed on cover plate by dispensing, MEMS is placed at the through hole of cover plate through dispensing. Closed space is surrounded by substrate, first side plate, second side plate, cover plate and MEMS to form a closed chamber. Therefore, the efficiency of providing MEMS to form closed chamber structure may be achieved.