Pasty adhesive composition and semiconductor device

A paste adhesive composition which is to be used as a highly reflective adhesive and contains silver particles, a monomer and a principal agent, wherein condition (A), condition (B) and condition (C) are satisfied by the reflectivity profile of reflected light produced by incident light which is inc...

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Bibliographische Detailangaben
Hauptverfasser:	NISHI, TAKAYUKI, SHIMOBE, YASUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A paste adhesive composition which is to be used as a highly reflective adhesive and contains silver particles, a monomer and a principal agent, wherein condition (A), condition (B) and condition (C) are satisfied by the reflectivity profile of reflected light produced by incident light which is incident at an angle of 8° relative to a flat surface of a cured film obtained by heating the paste adhesive composition from a temperature of 25°C to 175°C during a 30 minute interval, and then curing by performing a heat treatment for 30 minutes at 175°C. Condition (A): reflectivity B relative to 430nm wavelength of 45% or higher. Condition (B): reflectivity Y relative to 580nm wavelength of 45% or higher. Condition (C): reflectivity R relative to 650nm wavelength of 45% or higher.