ANTI-TILT IC COOLING SYSTEM BLOCK PRESSURE MOUNT ASSEMBLY

An anti-tilt pressure mount assembly adapted for mounting an IC cooling system block having a bottom surface to an upper surface of a packaged IC, the packaged IC mounted to a circuit board, comprising a block housing having a central member and pair of outwardly facing L-shaped flange legs, clamping assembly having ready and clamped positions, and plurality of attachment members is provided. The plurality of attachment members secure the anti-tilt pressure mount assembly to the circuit board. When the clamping assembly is in a ready position, the IC cooling system block housed in the block housing is not clamped to the packaged IC. When the clamping assembly is in a clamped position, a compressive load is uniformly distributed to the upper surface of the packaged IC. The bottom surface of the IC cooling system block is only in thermal contact with the upper surface of the packaged IC.