Resin molding apparatus and method for manufacturing a resin molded product

[Problem] To provide a resin molding device with a simple structure that allows easy exchange of release film and a method for producing a resin molded article. [Solution] The resin molding device 30 is equipped with a fixed frame 3A, a molding mold C, a movable platen 34, a mold clamping mechanism...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: ICHIHASHI, HIDEO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!