Resin molding apparatus and method for manufacturing a resin molded product

[Problem] To provide a resin molding device with a simple structure that allows easy exchange of release film and a method for producing a resin molded article. [Solution] The resin molding device 30 is equipped with a fixed frame 3A, a molding mold C, a movable platen 34, a mold clamping mechanism...

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1. Verfasser:	ICHIHASHI, HIDEO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	[Problem] To provide a resin molding device with a simple structure that allows easy exchange of release film and a method for producing a resin molded article. [Solution] The resin molding device 30 is equipped with a fixed frame 3A, a molding mold C, a movable platen 34, a mold clamping mechanism 35, and a film supply mechanism 1. The film supply mechanism 1 has a delivery mechanism 11 that is fixed to the fixed frame 3A and delivers a release film F, a recovery mechanism 12 that is fixed to the fixed frame 3A and recovers the release film F, and a pair of moving rollers 13a that are supported by the fixed frame 3A on the delivery mechanism 11 side and recovery mechanism 12 side in the transport path of the release film F and move in conjunction with displacement of the relative positions of the upper mold UM and lower mold LM.