Base plate, substrate assembly, method of processing a semiconductor substrate, apparatus for assembling a base plate and a semiconductor substrate, lithographic apparatus

A base plate configured to be attached to a semiconductor substrate, wherein the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and the base plate is made from a material having a Young's...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: DE VRIES, GOSSE CHARLES, VAN DER VOORT, DENNIS DOMINIC
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator DE VRIES, GOSSE CHARLES
VAN DER VOORT, DENNIS DOMINIC
description A base plate configured to be attached to a semiconductor substrate, wherein the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and the base plate is made from a material having a Young's modulus larger than 300 GPa.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TWI793741BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TWI793741BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TWI793741BB3</originalsourceid><addsrcrecordid>eNqNjbEKwkAQRNNYiPoP-wFnIRGCbUTRPmAZNpdNcnC5W24vhd_kT3pgMJ1YzcDMvFlnrxKFgC1GUiBTIzEkCyhCY2OfCkaKg2_Bd8DBaxIxrgeEFBvtXTvp6MMyVIDMmNwk0KVg5nw2zfcK0LW_INak0z4gD0YvxG226tAK7WbdZHC9VOfbntjXJIyaHMW6etyLU14cD2WZ_1F5A_0-WjY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Base plate, substrate assembly, method of processing a semiconductor substrate, apparatus for assembling a base plate and a semiconductor substrate, lithographic apparatus</title><source>esp@cenet</source><creator>DE VRIES, GOSSE CHARLES ; VAN DER VOORT, DENNIS DOMINIC</creator><creatorcontrib>DE VRIES, GOSSE CHARLES ; VAN DER VOORT, DENNIS DOMINIC</creatorcontrib><description>A base plate configured to be attached to a semiconductor substrate, wherein the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and the base plate is made from a material having a Young's modulus larger than 300 GPa.</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230221&amp;DB=EPODOC&amp;CC=TW&amp;NR=I793741B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230221&amp;DB=EPODOC&amp;CC=TW&amp;NR=I793741B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DE VRIES, GOSSE CHARLES</creatorcontrib><creatorcontrib>VAN DER VOORT, DENNIS DOMINIC</creatorcontrib><title>Base plate, substrate assembly, method of processing a semiconductor substrate, apparatus for assembling a base plate and a semiconductor substrate, lithographic apparatus</title><description>A base plate configured to be attached to a semiconductor substrate, wherein the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and the base plate is made from a material having a Young's modulus larger than 300 GPa.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjbEKwkAQRNNYiPoP-wFnIRGCbUTRPmAZNpdNcnC5W24vhd_kT3pgMJ1YzcDMvFlnrxKFgC1GUiBTIzEkCyhCY2OfCkaKg2_Bd8DBaxIxrgeEFBvtXTvp6MMyVIDMmNwk0KVg5nw2zfcK0LW_INak0z4gD0YvxG226tAK7WbdZHC9VOfbntjXJIyaHMW6etyLU14cD2WZ_1F5A_0-WjY</recordid><startdate>20230221</startdate><enddate>20230221</enddate><creator>DE VRIES, GOSSE CHARLES</creator><creator>VAN DER VOORT, DENNIS DOMINIC</creator><scope>EVB</scope></search><sort><creationdate>20230221</creationdate><title>Base plate, substrate assembly, method of processing a semiconductor substrate, apparatus for assembling a base plate and a semiconductor substrate, lithographic apparatus</title><author>DE VRIES, GOSSE CHARLES ; VAN DER VOORT, DENNIS DOMINIC</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TWI793741BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>DE VRIES, GOSSE CHARLES</creatorcontrib><creatorcontrib>VAN DER VOORT, DENNIS DOMINIC</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DE VRIES, GOSSE CHARLES</au><au>VAN DER VOORT, DENNIS DOMINIC</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Base plate, substrate assembly, method of processing a semiconductor substrate, apparatus for assembling a base plate and a semiconductor substrate, lithographic apparatus</title><date>2023-02-21</date><risdate>2023</risdate><abstract>A base plate configured to be attached to a semiconductor substrate, wherein the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and the base plate is made from a material having a Young's modulus larger than 300 GPa.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TWI793741BB
source esp@cenet
subjects APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
title Base plate, substrate assembly, method of processing a semiconductor substrate, apparatus for assembling a base plate and a semiconductor substrate, lithographic apparatus
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T18%3A48%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=DE%20VRIES,%20GOSSE%20CHARLES&rft.date=2023-02-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETWI793741BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true