Base plate, substrate assembly, method of processing a semiconductor substrate, apparatus for assembling a base plate and a semiconductor substrate, lithographic apparatus

A base plate configured to be attached to a semiconductor substrate, wherein the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and the base plate is made from a material having a Young's...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DE VRIES, GOSSE CHARLES, VAN DER VOORT, DENNIS DOMINIC
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A base plate configured to be attached to a semiconductor substrate, wherein the base plate is configured to remain attached to the semiconductor substrate during a sequence of processing steps performed on the semiconductor substrate, and the base plate is made from a material having a Young's modulus larger than 300 GPa.