Thin-film resistor (tfr) module with top-side interconnects connected to reduced tfr ridges and manufacturing methods

A method for manufacturing a thin film resistor (TFR) module in an integrated circuit (IC) structure is provided. A TFR trench may be formed in an oxide layer. A resistive TFR layer may be deposited over the structure and extending into the trench. Portions of the TFR layer outside the trench may be removed by CMP to define a TFR element including a laterally-extending TFR bottom region and a plurality of TFR ridges extending upwardly from the laterally-extending TFR bottom region. At least one CMP may be performed to remove all or portions of the oxide layer and at least a partial height of the TFR ridges. A pair of spaced-apart metal interconnects may then be formed over opposing end regions of the TFR element, wherein each metal interconnect contacts a respective upwardly-extending TFR ridge, to thereby define a resistor between the metal interconnects via the TFR element.