TWI788591B

A processing apparatus includes a holding table. The holding table includes a frustoconical portion and a wafer holding portion formed on the upper surface of the frustoconical portion for holding the wafer. Light is applied from a light emitting member to the side surface of the frustoconical porti...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MASUDA, YUKIYASU, KUSAKAWA, MAYUMI
Format: Patent
Sprache:chi
Schlagworte:
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Beschreibung
Zusammenfassung:A processing apparatus includes a holding table. The holding table includes a frustoconical portion and a wafer holding portion formed on the upper surface of the frustoconical portion for holding the wafer. Light is applied from a light emitting member to the side surface of the frustoconical portion and next reflected on the side surface of the frustoconical portion. The light reflected is applied to the outer circumference of the wafer held on the wafer holding portion of the holding table to thereby image the outer circumference of the wafer by an imaging unit.