Film for protective film formation, composite sheet for protective film formation, and method for forming semiconductor chip

Provided is a film (13) for forming a protective film, wherein the film (13) for forming a protective film is an energy ray-curable film; an adhesive strength between a silicon wafer and the film (13) for forming a protective film is at least 3 N/25 mm; and a shear strength of the protective film fo...

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Bibliographische Detailangaben
Hauptverfasser:	INAO, YOUICHI, KOBASHI, RIKIYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING USE OF MATERIALS AS ADHESIVES WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a film (13) for forming a protective film, wherein the film (13) for forming a protective film is an energy ray-curable film; an adhesive strength between a silicon wafer and the film (13) for forming a protective film is at least 3 N/25 mm; and a shear strength of the protective film formed by irradiating the film (13) for forming a protective film with ultraviolet ray is at least 10.5 N/3 mm.