Protective film-forming film and complex sheet for forming protective film

The present invention provides an energy ray-curable film for forming a protective film. The film for forming the protective film is capable of forming the protective film on the rear surface of a semiconductor wafer or a semiconductor chip, and is provided with a protective layer having a high elas...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	INAO, YOUICHI, KOBASHI, RIKIYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention provides an energy ray-curable film for forming a protective film. The film for forming the protective film is capable of forming the protective film on the rear surface of a semiconductor wafer or a semiconductor chip, and is provided with a protective layer having a high elastic modulus. This film 13 for forming the protective film is energy ray curable, and has a tensile elastic modulus of at least 30 MPa.