SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

The present invention relates to a substrate bonding apparatus including: a chamber; a first chuck disposed inside the chamber to adhere a first substrate; a second chuck disposed facingly inside the chamber toward the first chuck to adhere a second substrate; and a camera located above or under the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIM, WOO-PIL, HA, JOO-IL, NOH, DONG-MIN, KIM, JAE-HWAN, KIM, YEONG-BEEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention relates to a substrate bonding apparatus including: a chamber; a first chuck disposed inside the chamber to adhere a first substrate; a second chuck disposed facingly inside the chamber toward the first chuck to adhere a second substrate; and a camera located above or under the first chuck and the second chuck to recognize first alignment key disposed on the first substrate and second alignment key disposed on the second substrate.