TWI781377B

A semiconductor apparatus according to the present invention is a semiconductor apparatus on which a plurality of external terminals are disposed. The semiconductor apparatus includes: a first lead portions having die pads, first outer leads and first inner leads; chips; second lead portions having second outer leads and second inner lead; and a resin. On at least one of the first inner leads, the second inner leads and the die pads, a terminal temperature equalizing structure which restricts a heat transfer amount of heat transferred from the chips to predetermined external terminals, and equalizes respective terminal temperatures of a plurality of external terminals is formed.According to the semiconductor apparatus of the present invention, it is possible to prevent specific external terminals from becoming extremely high temperature when the semiconductor apparatus is mounted.