TWI781239B

The purpose of the present invention is to provide a curable resin composition which has superior flame retardancy, adhesiveness, high-temperature long-term heat resistance, and moisture-absorption reflow resistance, and low environmental impact. The purpose of the present invention is also to provi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WAKIOKA, SAYAKA, TAKEDA, KOHEI, SHINJO, TAKASHI, OATARI, YUTA
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a curable resin composition which has superior flame retardancy, adhesiveness, high-temperature long-term heat resistance, and moisture-absorption reflow resistance, and low environmental impact. The purpose of the present invention is also to provide a cured product of the curable resin composition, and an adhesive agent and adhesive film using the curable resin composition. The present invention is a curable resin composition containing a curable resin, an imide oligomer, and a boehmite-type aluminum oxide.