Solder alloy and resin flux cored solder

Provided is a solder alloy that contains 0.01 mass% or more and 0.1 mass% or less of Fe, 0.005 mass% or more and less than 0.02 mass% of Co, 0.1 mass% or more and 4.5 mass% or less of Ag, 0.1 mass% or more and 0.8 mass% or less of Cu, and the balance being Sn.

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Bibliographische Detailangaben
Hauptverfasser:	MORI, KIMIAKI, FURUSAWA, MITSUYASU, YUKIKATA, KAZUHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a solder alloy that contains 0.01 mass% or more and 0.1 mass% or less of Fe, 0.005 mass% or more and less than 0.02 mass% of Co, 0.1 mass% or more and 4.5 mass% or less of Ag, 0.1 mass% or more and 0.8 mass% or less of Cu, and the balance being Sn.