Flexible metal clad laminate film, article including the same, and method of preparing the film

Disclosed are a flexible metal clad laminate, an article comprising same, and a method for manufacturing the flexible metal clad laminate. The disclosed flexible metal clad laminate comprises: a substrate layer; a first metal foil film layer disposed on the substrate layer; and a second metal foil f...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, YONG HO, JEONG, WOO DEUK, JEONG, SEUNG MO, LEE, BYEONG GUK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed are a flexible metal clad laminate, an article comprising same, and a method for manufacturing the flexible metal clad laminate. The disclosed flexible metal clad laminate comprises: a substrate layer; a first metal foil film layer disposed on the substrate layer; and a second metal foil film layer disposed on the first metal foil film layer, wherein the flexible metal clad laminate has a pinhole defect of 100 or less per unit surface area (m2) and 100 or fewer protrusions ranging from 1㎛ and to 2㎛ (both exclusive) per unit surface area (m2).