TWI777939B

The present invention provides a copper-clad laminate that has a high reflectance with respect to visible light and ultraviolet light and exhibits superior resistance to ultraviolet light and to heat. The copper-clad laminate according to the present invention has a copper layer, a while-color layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ORITA, TAKAHIRO, IWAISAKO, YASUSHI, FURUKAWA, KOUTARO, OOGAMI, HIROYUKI, UENO, YASUTSUGU
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a copper-clad laminate that has a high reflectance with respect to visible light and ultraviolet light and exhibits superior resistance to ultraviolet light and to heat. The copper-clad laminate according to the present invention has a copper layer, a while-color layer, an adhesive layer, and a high-temperature conductive substrate having a thermal conductivity of 200 W/m·K or higher, in that order, wherein: the white-color layer is configured to have a composition in which a matrix of a highly ultraviolet-resistant organopolysiloxane includes therein a filler selected from any of BN, ZrO2, SiO2, CaF2, and diamond that exhibit a high ultraviolet reflectance; and the white-color layer and the high-temperature conductive substrate are bonded together using a thermosetting resin.