TWI775727B

A resin composition (10) according to the present invention contains a thermoplastic resin (11) and nanodiamond particles (12). The thermoplastic resin (11) has a melting point of 280°C or higher or a glass transition temperature of 220°C or higher. In the resin composition (10), the nanodiamond par...

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Hauptverfasser: KUME, ATSUSHI, ITO, HISAYOSHI
Format: Patent
Sprache:chi
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Zusammenfassung:A resin composition (10) according to the present invention contains a thermoplastic resin (11) and nanodiamond particles (12). The thermoplastic resin (11) has a melting point of 280°C or higher or a glass transition temperature of 220°C or higher. In the resin composition (10), the nanodiamond particles (12) are present in an amount of typically 0.001 to 5 parts by weight per 100 parts by weight of the totality of the thermoplastic resin (11). The resin composition (10) as above is suitable for realizing high heat resistance while restraining deterioration and thickening upon working with heating.