TWI775294B

The object of the present invention is to provide a polyimide precursor composition that can produce a polyimide film/substrate laminate with a less warpage and an excellent stability, and to provide a manufacturing method of a polyimide film/substrate laminate and flexible electronic devices. The p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OKA, TAKUYA, KOHAMA, YUKINORI
Format:	Patent
Sprache:	chi
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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