TWI775294B

The object of the present invention is to provide a polyimide precursor composition that can produce a polyimide film/substrate laminate with a less warpage and an excellent stability, and to provide a manufacturing method of a polyimide film/substrate laminate and flexible electronic devices. The polyimide precursor composition of the present invention is characterized by containing: a polyimide precursor, which is represented by the following general formula (I); an imidazole compound, which is selected from at least one of 2-phenylimidazole and benzimidazole. The content of the imidazole compound relative to one mole of a repeating unit of the polyimide precursor falls within a range of more than 0.01 mole and less than 1 mole. The polyimide precursor composition also includes a solvent. In the general formula (I), 70 mol% or more of X1 is the structure represented by formula (1-1), and 70 mol% or more of Y1 is the formula (D-1) and/or (D-2).