TWI774745B

Provided is an adhesive sheet comprising: a non-adhesive thermally expandable substrate containing a resin and thermally expandable particles that have an expansion start temperature (t) of 120-250°C; and an adhesive layer containing an adhesive resin. The thermally expandable substrate satisfies th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	AKUTSU, TAKASHI, KATO, KIICHIRO
Format:	Patent
Sprache:	chi
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is an adhesive sheet comprising: a non-adhesive thermally expandable substrate containing a resin and thermally expandable particles that have an expansion start temperature (t) of 120-250°C; and an adhesive layer containing an adhesive resin. The thermally expandable substrate satisfies the requirements (1) and (2) indicated below. Requirement (1): the storage elastic modulus E'(23) of the thermally expandable substrate at 23°C is 1.0 × 106 Pa or more. Requirement (2): the storage elastic modulus E'(t) of the thermally expandable substrate at the expansion start temperature (t) of the thermally expandable particles is 1.0 × 107 Pa or less.