POLISHING DELIVERY APPARUTUS

A polishing delivery apparatus, configured to provide slurry and rinse agent to a polishing pad, includes a delivery arm, at least one first nozzle, and at least one second nozzle. The delivery arm is rotatably connected to the polishing pad and has an arc-shaped top surface facing away from the pol...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HSU, CHIH-WANG, WANG, JIUN-BO, SU, CHIA-HUNG, CHEN, CHIH-YUAN, HSIEH, YUANI, TSAI, MING-FA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING PIPE-LINE SYSTEMS PIPE-LINES SEMICONDUCTOR DEVICES STORING OF DISTRIBUTING GASES OR LIQUIDS WEAPONS
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Beschreibung
Zusammenfassung:	A polishing delivery apparatus, configured to provide slurry and rinse agent to a polishing pad, includes a delivery arm, at least one first nozzle, and at least one second nozzle. The delivery arm is rotatably connected to the polishing pad and has an arc-shaped top surface facing away from the polishing pad, a bottom surface facing away from the arc-shaped top surface, and a recess indenting from the bottom surface. The first nozzle is mounted on the bottom surface of the delivery arm and has a first nozzle head facing toward the polishing pad. The second nozzle is mounted in the recess of the delivery arm and has three second nozzle heads, in which one of the three second nozzle heads faces toward the polishing pad, and the other two of the three second nozzle heads face toward sidewalls of the recess.