TWI770118B

A substrate treatment system which comprises a heat treatment device, etc. as a treatment device for treating a substrate, and which is provided with a conveyance region for conveying a wafer W to the treatment device, wherein the substrate treatment system is also provided with a sound-wave-emittin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YASUTAKE, TAKAHIRO, FUNAKOSHI, HIDEO, HASHIMA, HITOSHI, MATSUOKA, NOBUAKI, NAKASHIMA, TSUNENAGA, NAKAMURA, HIROSHI
Format:	Patent
Sprache:	chi
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A substrate treatment system which comprises a heat treatment device, etc. as a treatment device for treating a substrate, and which is provided with a conveyance region for conveying a wafer W to the treatment device, wherein the substrate treatment system is also provided with a sound-wave-emitting device for emitting sound waves to prevent the adherence to the substrate of suspended particles within the conveyance region. The sound-wave-emitting device is provided, for example, at a region adjacent to a wafer carry-in/carry-out opening of the heat treatment device in the conveyance region, and at a region adjacent to a substrate carry-in/carry-out opening with respect to a cassette loading unit in a substrate conveyance region. In addition, the sound-wave-reflecting device may be attached to a substrate conveyance device.