Fan-out semiconductor package and manufacturing method thereof

A fan-out semiconductor package may include: a first connection member having a through hole; a semiconductor chip disposed in the through hole and having an active surface on which a connection pad is disposed and a non-active surface opposing the active surface; an encapsulant at least partially e...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, JONG RIP, LEE, DOO HWAN, OH, KYUNG SEOB, KIM, HYOUNG JOON
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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