Fan-out semiconductor package and manufacturing method thereof

A fan-out semiconductor package may include: a first connection member having a through hole; a semiconductor chip disposed in the through hole and having an active surface on which a connection pad is disposed and a non-active surface opposing the active surface; an encapsulant at least partially encapsulating the first connection member and the non-active surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad, wherein the first connection member includes a first insulating layer, a first redistribution layer embedded in the first insulating layer while contacting the second connection member, and a second redistribution layer disposed on the other side of the first insulating layer opposing one side thereof in which the first redistribution layer is embedded.