TWI767004B

An objective of the present invention is to measure curvature at the time of destruction of a chip when evaluating flexure strength of the chip. A method of measuring curvature of a chip when the chip is destroyed in a bending test of the chip comprises: a chip retaining step of retaining a first ar...

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Bibliographische Detailangaben
1. Verfasser: MATSUZAKI, SAKAE
Format: Patent
Sprache:chi
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Beschreibung
Zusammenfassung:An objective of the present invention is to measure curvature at the time of destruction of a chip when evaluating flexure strength of the chip. A method of measuring curvature of a chip when the chip is destroyed in a bending test of the chip comprises: a chip retaining step of retaining a first area of one end of a chip on a support surface of a first retaining means, and retaining a second area of the other end of the chip on a support surface of a second retaining means; a first moving step of relatively moving the first and second retaining means to allow a cross sectional shape of a measurement area between the first and the second area of the chip to become an arc shape to allow the support surface of the first retaining means and the support surface of the second retaining means to face each other; a second moving step of relatively moving the first and second retaining means towards each other; a chip destruction detection step of detecting destruction of the chip; and a curvature detection step of d