Method for producing a flow cell package

A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least...

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Bibliographische Detailangaben
Hauptverfasser:	TSAY, JAMES, MALEVANCHIK, LEONID, RAMIREZ, SEAN M, BEIERLE, JOHN M, MUNOZ, KRISTINA, AHN, SUNMIN, SHIEH, PEYTON, SAMIEE, KEVAN, HUANG, YUXIANG, LI, EDWIN, PARK, SANG, YANG, ROBERT, HEINER, DAVID, WEI, WEI, VINCENT, LUDOVIC, UZZELL, VALERIE, SCHMITT, SAMANTHA, BAILEY, SCOTT, PRABHU, ANMIV, DILL, TYLER JAMISON, RICHEZ, ALEXANDRE, ZHAN, NAIQIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.