TWI765870B

A film, a method for producing a film, the use of a film for application to a target substrate as well as a method for producing an electrical functional element. The film here includes a carrier substrate, an adhesion-promoting layer for applying the film to a target substrate, and at least one ele...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HEINRICH, MATTHIAS, HIRSCHFELDER, ANDREAS, HAHN, MARTIN, SCHAD, JOHANNES
Format: Patent
Sprache:chi
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Beschreibung
Zusammenfassung:A film, a method for producing a film, the use of a film for application to a target substrate as well as a method for producing an electrical functional element. The film here includes a carrier substrate, an adhesion-promoting layer for applying the film to a target substrate, and at least one electrically conductive layer, wherein the at least one electrically conductive layer forms an electrical functional structure in a functional region, wherein the at least one electrically conductive layer forms at least one contacting structure for contacting the electrical functional structure in at least one contacting region, and wherein the adhesion-promoting layer does not cover the at least one contacting region at least in areas when viewed perpendicularly to a plane spanned by the carrier substrate or wherein the adhesion-promoting layer is applied over the whole surface when viewed perpendicularly to a plane spanned by the carrier substrate.